토요일, 3월 02, 2024

A Peek at Intel’s Future Foundry Tech

[IEEE Spectrum] A Peek at Intel’s Future Foundry Tech 3D chip tech, smaller logic cells, backside power, and more

SAMUEL K. MOORE21 FEB 2024 / https://spectrum.ieee.org/intel-18a


A map of Intel's future Clearwater Forest CPU is useful to explain the technologies Intel will offer through its foundry services. INTEL

3D hybrid bonding links compute dies to base dies.INTEL


PowerVia puts the silicon’s power supply network below, leaving more room for data-carrying interconnects above.INTEL


RibbonFET is Intel’s take on nanowire transistors.INTEL

Dense 2D connections are formed by a small sliver of silicon called EMIB, which is embedded in the package substrate.INTEL

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