[IEEE Spectrum] A Peek at Intel’s Future Foundry Tech 3D chip tech, smaller logic cells, backside power, and more
SAMUEL K. MOORE21 FEB 2024 / https://spectrum.ieee.org/intel-18a
A map of Intel's future Clearwater Forest CPU is useful to explain the technologies Intel will offer through its foundry services. INTEL
3D hybrid bonding links compute dies to base dies.INTEL
PowerVia puts the silicon’s power supply network below, leaving more room for data-carrying interconnects above.INTEL
RibbonFET is Intel’s take on nanowire transistors.INTEL
Dense 2D connections are formed by a small sliver of silicon called EMIB, which is embedded in the package substrate.INTEL------------------------------------
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